A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-014-2177-7
Published Online: 2014-07-27
Published Print: 2014-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Huayu
Li, Qingqian
Chan, Y. C.
Text and Data Mining valid from 2014-07-27