Creep failure mechanism and life prediction of lead-free solder joint
Crossref DOI link: https://doi.org/10.1007/s10854-014-2394-0
Published Online: 2014-10-18
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Yongxin
Li, Xiaoyan
Gao, Ruiting
Text and Data Mining valid from 2014-10-18
