Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2398-9
Published Online: 2014-10-28
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chia, Pay Ying
Haseeb, A. S. M. A.
Text and Data Mining valid from 2014-10-28