Stress reduction in silicon/oxidized silicon–Pyrex glass anodic bonding for MEMS device packaging: RF switches and pressure sensors
Crossref DOI link: https://doi.org/10.1007/s10854-014-2415-z
Published Online: 2014-10-26
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Joyce, Robin
Singh, Kulwant
Varghese, Soney
Akhtar, Jamil
Text and Data Mining valid from 2014-10-26