Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact
Crossref DOI link: https://doi.org/10.1007/s10854-014-2441-x
Published Online: 2014-10-29
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Niu, Xiao-Yan
Li, Wei
Wang, Gui-Xiang
Shu, Xue-Feng
Text and Data Mining valid from 2014-10-29
