Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder
Crossref DOI link: https://doi.org/10.1007/s10854-014-2443-8
Published Online: 2014-11-21
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Li
Ge, Jinguo
Zhang, Yaocheng
Dai, Jun
Jing, Yanfeng
Text and Data Mining valid from 2014-11-21