Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn–0.7Cu lead-free solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-014-2577-8
Published Online: 2014-12-06
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Jun
Pu, Yayun
Wu, Dong
Tang, Qin
Zhao, Mali
Text and Data Mining valid from 2014-12-06
