Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions
Crossref DOI link: https://doi.org/10.1007/s10854-014-2589-4
Published Online: 2014-12-18
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Sang-Min
Yoon, Jeong-Won
Jung, Seung-Boo
Text and Data Mining valid from 2014-12-18