Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging
Crossref DOI link: https://doi.org/10.1007/s10854-014-2621-8
Published Online: 2014-12-21
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, R. W.
Tsao, L. C.
Chen, R. S.
Text and Data Mining valid from 2014-12-21