Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape
Crossref DOI link: https://doi.org/10.1007/s10854-014-2633-4
Published Online: 2014-12-20
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Ping
Zhao, Xiuchen
Wang, Yong
Liu, Ying
Li, Hong
Gu, Yue
Text and Data Mining valid from 2014-12-20