Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-2664-5
Published Online: 2015-01-07
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, Ruiting
Li, Xiaoyan
Zhu, Yongxin
Text and Data Mining valid from 2015-01-07