Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy
Crossref DOI link: https://doi.org/10.1007/s10854-015-2723-y
Published Online: 2015-01-31
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ramachandran, Koushik
Pruyn, Timothy L.
Huang, Timothy
Wang, Yushu
Singh, Preet M.
Jud Ready, W.
Gerhardt, Rosario A.
Sundaram, Venky
Tummala, Rao
Text and Data Mining valid from 2015-01-31