Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-2736-6
Published Online: 2015-03-20
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
An, Rong
Tian, Yanhong
Zhang, Rui
Wang, Chunqing
Text and Data Mining valid from 2015-03-20
