Effect of alloying Cu substrate on microstructure and coarsening behavior of Cu6Sn5 grains of soldered joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-2759-z
Published Online: 2015-02-12
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yu, Xiao
Hu, Xiaowu
Li, Yulong
Zhang, Ruhua
Text and Data Mining valid from 2015-02-12