Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders
Crossref DOI link: https://doi.org/10.1007/s10854-015-2860-3
Published Online: 2015-02-26
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, C. H.
Chen, Chin-Hsin
Chang, S. Y.
Tsao, L. C.
Chen, R. S.
Text and Data Mining valid from 2015-02-26