Creep behavior of SnAgCu solders containing nano-Al particles
Crossref DOI link: https://doi.org/10.1007/s10854-015-2876-8
Published Online: 2015-03-17
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Liang
Han, Ji-guang
Guo, Yong-huan
Sun, Lei
Text and Data Mining valid from 2015-03-17