Document is current

Any future updates will be listed below

Residual stress in copper paste films on alumina substrates

Crossref DOI link: https://doi.org/10.1007/s10854-015-2953-z

Published Online: 2015-05-29

Published Print: 2015-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark