Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-2984-5
Published Online: 2015-03-27
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wei, G. Q.
Du, L. C.
Jia, Y. P.
Qi, L.
Text and Data Mining valid from 2015-03-27
