Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-3040-1
Published Online: 2015-04-11
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Huayu
Chan, Y. C.
Wu, Fengshun
Text and Data Mining valid from 2015-04-11