A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions
Crossref DOI link: https://doi.org/10.1007/s10854-015-3042-z
Published Online: 2015-04-19
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hu, Xiaowu
Huang, Qiang
Li, Yulong
Liu, Yi
Min, Zhixian
Text and Data Mining valid from 2015-04-19