The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-3071-7
Published Online: 2015-04-19
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Huayu
Chan, Y. C.
Wu, Fengshun
Text and Data Mining valid from 2015-04-19