Crossmark

Influence of gallium addition in Sn–Ag–Cu lead-fee solder

Crossref DOI link: https://doi.org/10.1007/s10854-015-3102-4

Published Online: 2015-04-25

Published Print: 2015-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, HuiMing

Guo, ChengJun

Huang, JiaPeng

Wang, Hang
Funding

Funding for this research was provided by:

Jiangxi University of Science and Technology Project (3304000029)

Jiangxi Education Department Project (GJJ14447)
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Text and Data Mining valid from 2015-04-25