Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder
Crossref DOI link: https://doi.org/10.1007/s10854-015-3151-8
Published Online: 2015-05-07
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Yong
Zhao, Xiuchen http://orcid.org/0000-0002-0297-4015
Xie, Xiaochen
Gu, Yue
Liu, Ying
Text and Data Mining valid from 2015-05-07