Influence of temperature on MWCNT bundle, SWCNT bundle and copper interconnects for nanoscaled technology nodes
Crossref DOI link: https://doi.org/10.1007/s10854-015-3193-y
Published Online: 2015-05-17
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Singh, Karmjit
Raj, Balwinder
Text and Data Mining valid from 2015-05-17