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Microstructure evolution and electrical property improvement of Mn-based thin film thermistors with the sandwich structure

Crossref DOI link: https://doi.org/10.1007/s10854-015-3218-6

Published Online: 2015-05-27

Published Print: 2015-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

He, L.

Ling, Z. Y.

Wu, M. Y.

Zhang, G.

Ling, D. X.

Liu, M. X.

Yang, L.
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