Crossmark

Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Crossref DOI link: https://doi.org/10.1007/s10854-015-3325-4

Published Online: 2015-06-13

Published Print: 2015-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Gain, Asit Kumar

Zhang, Liangchi

Chan, Y. C.
Funding

Funding for this research was provided by:

The University of New South Wales (UNSW) (InfoEd Ref: RG124326)
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