Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder joint interface during different thermal conditions
Crossref DOI link: https://doi.org/10.1007/s10854-015-3406-4
Published Online: 2015-06-30
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Shuai
Yan, Yan-fu
Text and Data Mining valid from 2015-06-30