Effect of porous copper on the properties of electrically conductive adhesives
Crossref DOI link: https://doi.org/10.1007/s10854-015-3423-3
Published Online: 2015-07-03
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ho, Li-Ngee
Nishikawa, Hiroshi
Funding for this research was provided by:
Japan Society for the Promotion of Science (23-01376)
Text and Data Mining valid from 2015-07-03
Version of Record valid from 2015-07-03
Article History
Received: 6 January 2015
Accepted: 29 June 2015
First Online: 3 July 2015