Crossmark

Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering

Crossref DOI link: https://doi.org/10.1007/s10854-015-3451-z

Published Online: 2015-07-09

Published Print: 2015-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ma, Yunzhu

Luo, Huiting

Li, Yongjun

Liu, Wensheng

Wang, Yikai

Huang, Boyun
Funding

Funding for this research was provided by:

Creative research group of National Natural Science Foundation of China (50721003)

National Natural Science Foundation of China (50774098)
License Information

Text and Data Mining valid from 2015-07-09