Crossmark

Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method

Crossref DOI link: https://doi.org/10.1007/s10854-015-3486-1

Published Online: 2015-07-15

Published Print: 2015-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Shnawah, Dhafer Abdulameer

Sabri, Mohd Faizul Mohd

Said, Suhana Binti Mohd

Jauhari, Iswadi

Mahdavifard, Mohammad Hossein

Bashir, Mohamed Bashir Ali

Elsheikh, Mohamed Hamid
Funding

Funding for this research was provided by:

Universiti Malaya (UMRG Grant RP003B-13AET)

Universiti Malaya (HIR grant No.: UM.C/625/1/HIR/M/OHE/ENG/29)
License Information

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