Growth kinetics of intermetallic layer in lead-free Sn–5Sb solder reinforced with multi-walled carbon nanotubes
Crossref DOI link: https://doi.org/10.1007/s10854-015-3488-z
Published Online: 2015-08-08
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dele-Afolabi, T. T.
Azmah Hanim, M. A.
Norkhairunnisa, M.
Yusoff, H. M.
Suraya, M. T.
Text and Data Mining valid from 2015-08-08