Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content
Crossref DOI link: https://doi.org/10.1007/s10854-015-3580-4
Published Online: 2015-08-14
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Wen-dong
Wang, Chang-hai
Arrighi, Valeria
Liu, Chun-yan
Watson, David
Funding for this research was provided by:
Chinese Academy of Sciences (No.2014.8)
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