Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends
Crossref DOI link: https://doi.org/10.1007/s10854-015-3635-6
Published Online: 2015-09-04
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, Ephraim
Ghaffarian, Reza
Text and Data Mining valid from 2015-09-04