Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-015-3724-6
Published Online: 2015-09-03
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Yunzhu
Luo, Huiting
Liu, Wensheng
Huang, Yufeng
Yu, Qiang
Li, Yongjun
Funding for this research was provided by:
National Natural Science Foundation of China (50774098)
Text and Data Mining valid from 2015-09-03