Influence of latent heat released from solder joints on the reflow temperature profile
Crossref DOI link: https://doi.org/10.1007/s10854-015-3787-4
Published Online: 2015-10-07
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dušek, K.
Rudajevová, A.
Plaček, M.
Funding for this research was provided by:
Grant Agency of the Czech Technical University in Prague (SGS15/196/OHK3/3T/13)
Czech Research Infrastructures (LM 2011025)
Text and Data Mining valid from 2015-10-07