Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?
Crossref DOI link: https://doi.org/10.1007/s10854-015-3790-9
Published Online: 2015-10-28
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Ghaffarian, R.
Nicolics, J.
Text and Data Mining valid from 2015-10-28
