Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design
Crossref DOI link: https://doi.org/10.1007/s10854-015-4042-8
Published Online: 2015-11-25
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Ghaffarian, R.
Nicolics, J.
Text and Data Mining valid from 2015-11-25