Low temperature chip on film bonding technology for 20 µm pitch applications
Crossref DOI link: https://doi.org/10.1007/s10854-015-4205-7
Published Online: 2015-12-14
Published Print: 2016-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Sun-Chul
Kim, Young-Ho
Text and Data Mining valid from 2015-12-14