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Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends

Crossref DOI link: https://doi.org/10.1007/s10854-016-4310-2

Published Online: 2016-01-19

Published Print: 2016-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy