Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief
Crossref DOI link: https://doi.org/10.1007/s10854-016-4363-2
Published Online: 2016-02-03
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Text and Data Mining valid from 2016-02-03
