Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-016-4373-0
Published Online: 2016-01-22
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tao, Yeqing
Ding, Dongyan
Li, Ting
Guo, Jason
Yu, Yunhong
Funding for this research was provided by:
China National Major Scientific Instruments Equipment Development Project (2012YQ15000105)
Text and Data Mining valid from 2016-01-22