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Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging

Crossref DOI link: https://doi.org/10.1007/s10854-016-4464-y

Published Online: 2016-02-06

Published Print: 2016-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wu, Guanglei

Cheng, Yonghong

Wang, Kuikui

Wang, Yiqun

Feng, Ailing
Funding

Funding for this research was provided by:

National Science Foundation of China (No.51407134)

China Postdoctoral Science Special Foundation (No.2015T81028)

Natural Science Basic Research Plan in Shaanxi Province of China (No.2014JQ6199, No.2015JM5215)
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