Whisker growth on SnAgCu–xPr solders in electronic packaging
Crossref DOI link: https://doi.org/10.1007/s10854-016-4468-7
Published Online: 2016-02-22
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Liang
Yang, Fan
Zhong, Su-juan
Funding for this research was provided by:
Natural Science Foundation of China (51475220)
Text and Data Mining valid from 2016-02-22