Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy
Crossref DOI link: https://doi.org/10.1007/s10854-016-4609-z
Published Online: 2016-03-07
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, N.
Huang, M. L.
Wu, C. M. L.
Funding for this research was provided by:
National Natural Science Foundation of China (51301030)
Specialized Research Fund for the Doctoral Program of Higher Education of China (20120041120038)
Text and Data Mining valid from 2016-03-07