Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
Crossref DOI link: https://doi.org/10.1007/s10854-016-4635-x
Published Online: 2016-03-09
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Ze http://orcid.org/0000-0003-2331-1752
Sun, Huayu
Wu, Fengshun
Chan, Yan-cheong
Funding for this research was provided by:
the Research Grants Council of Hong Kong (9041636)
the National Natural Science Foundation of China (9054008)
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