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Preparation of selective conductive copper patterns by pen-on-paper writing combined with electroless plating

Crossref DOI link: https://doi.org/10.1007/s10854-016-4701-4

Published Online: 2016-03-19

Published Print: 2016-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hou, Lei

Lu, Yinxiang

Zhao, Hang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (61371019)

Shanghai Civil-military Integration Project (140217)
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Text and Data Mining valid from 2016-03-19