Pretreatment to assure the copper filling in through-silicon vias
Crossref DOI link: https://doi.org/10.1007/s10854-016-4723-y
Published Online: 2016-04-07
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Luo, Wei
Zhang, Junhong
Li, Yi
Gao, Liming
Li, Ming
Funding for this research was provided by:
National Basic Research Program of China (2015CB057200)
National Nature Science Foundation of China (61274104)
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