Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys
Crossref DOI link: https://doi.org/10.1007/s10854-016-4732-x
Published Online: 2016-03-26
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gain, Asit Kumar
Zhang, Liangchi
Funding for this research was provided by:
The University of New South Wales (UNSW) (InfoEd Ref: RG124326)
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