Low-temperature sintering of metallacyclic stabilized copper nanoparticles and adhesion enhancement of conductive copper film to a polyimide substrate
Crossref DOI link: https://doi.org/10.1007/s10854-016-4734-8
Published Online: 2016-03-26
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sugiyama, Tomonori
Kanzaki, Mai
Arakawa, Ryuichi
Kawasaki, Hideya
Text and Data Mining valid from 2016-03-26