Power core (PC) embedding a plurality of IC devices and sandwiched between two dissimilar insulated metal substrates (IMS’): predicted thermal stresses
Crossref DOI link: https://doi.org/10.1007/s10854-016-4749-1
Published Online: 2016-04-07
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Nicolics, J.
Text and Data Mining valid from 2016-04-07
